The THERMOCHIP FLOOR PLUS system, apart from the panel, adds a high density plank to reduce airborne and impact nose and an industrialized technical panel for underfloor heating system. Changes could be made depending on the energy requirement demands. This panel, which has been made ad hoc and longitudinally mechanised, has a heating pipe within.
Finally, a plaster fibreboard is also installed which will be the supporting flooring base of the building (for wood, ceramic tiles, etc.). All this makes up a complete system for the dry construction you desire. The design and development of the FLOOR PLUS system can be used with the BIM method and can be adapted to each project.