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THERMOCHIP TH – Chipboard
10 March 2026
THERMOCHIP TFbc – Fibre cement
10 March 2026
Pitched roof Dual-layer

THERMOCHIP TO – OSB3

THERMOCHIP BICAPA TO – OSB3, is made up of an insulating layer of extruded polystyrene and an OSB board.

  • 1

    Abroad

    10/15mm thick OSB3 board

  • 2

    Core

    Extruded polystyrene (XPS) of variable thickness 40-200mm

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THERMOCHIP TO – OSB3
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THERMOCHIP TO – OSB3
Sizes

2400/3000mm x 550mm

Characteristics

Thermal insulation

Insulating core of variable thickness that allows the transmittance to be adapted to the needs of each project.

Acoustic insulation

Continuous acoustic insulation in the building envelope.

Wide variety of finishes

Wide range to adapt to specific projects.

waterproof sheet

Possibility of incorporating the PLUS system on the outside for extra resistance to the passage of water.

ETE Certificate

Insulating core of variable thickness that allows the transmittance to be adapted to the needs of each project.

CE marking

Cumple normativa europea con marcado CE.

Time reduction

Panels that unify decoration, insulation and exterior support.

Technical assistance

Technical department at your disposal to solve any query.