THERMOCHIP® presents GRAN FORMATO and BICAPA, the most efficient panels

THERMOCHIP® expands its range of products withtwo new wooden sandwich panels: BICAPAandGRAN FORMATO, which will be presented at the International Week of Efficient Construction and Rehabilitation, SICRE 2014, which starts tomorrow at the IFEMA exhibition centre.

At our stand 7F07 in Pavilion 7 of the International Sustainable Construction Solutions Exhibition, you can find information about THERMOCHIP® BICAPA, the THERMOCHIP® solution for greater insulation in the ceilings, floors and walls of your home. Combinelightness, resistance and savingsin a simple format, which is installed directly on site. The panel, made up of an extruded polystyrene core and an outer board, has different thicknesses depending on the needs ofenergy efficiencyof your home.

RESISTANT TO MOISTURE

Visitors to SICRE 2014 will be able to see first-hand the benefits ofTHERMOCHIP® BICAPAwhich offers the finishes of water-repellent chipboard (moisture-resistant) and OSB3 board (made of wood chips).

The other big news is THERMOCHIP® GRAN FORMATO, the panel designed for large works. Thanks to the possibility of manufacturing in various formats, up to 5 metres in length, our sandwich panel adapts to all types of projects, obtaining the maximumsavings in material taking advantage of its entire surface.

For more information,check our website.